Invention Grant
US07449381B2 Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate
有权
制造用作较大电路基板的一部分的电容基板的方法，制造所述电路化基板的方法和制造包括所述电路化基板的信息处理系统的方法
- Patent Title: Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate
- Patent Title (中): 制造用作较大电路基板的一部分的电容基板的方法，制造所述电路化基板的方法和制造包括所述电路化基板的信息处理系统的方法
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Application No.: US11352279Application Date: 2006-02-13
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Publication No.: US07449381B2Publication Date: 2008-11-11
- Inventor: Rabindra N. Das , John M. Lauffer , How T. Lin , Voya R. Markovich
- Applicant: Rabindra N. Das , John M. Lauffer , How T. Lin , Voya R. Markovich
- Applicant Address: US NY Endicott
- Assignee: Endicott Interconect Technologies, Inc.
- Current Assignee: Endicott Interconect Technologies, Inc.
- Current Assignee Address: US NY Endicott
- Agency: Hinman, Howard & Kattell
- Agent Mark Levy; Lawrence R. Fraley
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L21/00
Abstract:
A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.
Public/Granted literature
Information query
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