Invention Grant
- Patent Title: Hard mask composition and method for manufacturing semiconductor device
- Patent Title (中): 半导体器件的硬掩模组成和方法
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Application No.: US11421897Application Date: 2006-06-02
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Publication No.: US07449538B2Publication Date: 2008-11-11
- Inventor: Geun Su Lee
- Applicant: Geun Su Lee
- Applicant Address: KR Gyeonggi-Do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Marshall, Gerstein & Borun LLP
- Priority: KR10-2005-0135270 20051230
- Main IPC: C08G77/04
- IPC: C08G77/04
Abstract:
Disclosed herein is a cross-linking polymer that includes a silicon compound and a hydroxyl compound. Also disclosed herein is a composition that includes the cross-linking polymer and an organic solvent. The composition can be used as a part of hard mask film applied over an underlying layer during the manufacture of a semiconductor device. The hard mask film is useful in the formation of a uniform pattern on the device.
Public/Granted literature
- US20070154838A1 Hard Mask Composition and Method for Manufacturing Semiconductor Device Public/Granted day:2007-07-05
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