发明授权
- 专利标题： Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same
- 专利标题（中）： 具有电绝缘散热器的半导体功率模块及其制造方法
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申请号： US09677558申请日： 2000-09-29
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公开(公告)号： US07449774B1公开(公告)日： 2008-11-11
- 发明人: Gi-Young Jeun , O-Seob Jeun , Eun-Ho Lee , Seung-Won Lim
- 申请人： Gi-Young Jeun , O-Seob Jeun , Eun-Ho Lee , Seung-Won Lim
- 申请人地址： KR Kyungki-do
- 专利权人： Fairchild Korea Semiconductor Ltd.
- 当前专利权人： Fairchild Korea Semiconductor Ltd.
- 当前专利权人地址： KR Kyungki-do
- 代理机构： Marshall Gerstein & Borun LLP
- 优先权： KR1999-42217 19991001
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator is adjacent to a second surface of the first portion of the lead frame. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit and the control circuit.
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