公开(公告)号：US07449774B1

公开(公告)日：2008-11-11

申请号：US09677558

申请日：2000-09-29

申请人： Gi-Young Jeun ,  O-Seob Jeun ,  Eun-Ho Lee ,  Seung-Won Lim

发明人： Gi-Young Jeun ,  O-Seob Jeun ,  Eun-Ho Lee ,  Seung-Won Lim

IPC分类号： H01L23/34

CPC分类号： H01L23/49575 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator is adjacent to a second surface of the first portion of the lead frame. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit and the control circuit.

摘要翻译： 半导体功率模块包括具有第一电平的第一部分的引线框架和围绕第二部分的第二电平的第二部分和连接到第二部分的多个端子。 半导体功率模块还包括安装在第一部分的第一表面上的电源电路和具有电绝缘性能和导热性的绝缘体。 绝缘体与引线框架的第一部分的第二表面相邻。 半导体功率模块还包括具有覆盖电源电路和控制电路的电绝缘性能的密封器。

公开(公告)号：US20060113562A1

公开(公告)日：2006-06-01

申请号：US11327073

申请日：2006-01-06

申请人： Gi-Young Jeun ,  O-Seob Jeun ,  Eun-Ho Lee ,  Seung-Won Lim

发明人： Gi-Young Jeun ,  O-Seob Jeun ,  Eun-Ho Lee ,  Seung-Won Lim

IPC分类号： H01L23/495 ,  H01L31/111

CPC分类号： H01L23/49575 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator has a first surface adjacent to a second surface of the first portion, and a second surface opposite to the first surface of the insulator and exposed to the outside. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit.

公开(公告)号：US07501700B2

公开(公告)日：2009-03-10

申请号：US11327073

申请日：2006-01-06

申请人： Gi-Young Jeun ,  O-Seob Jeun ,  Eun-Ho Lee ,  Seung-Won Lim

发明人： Gi-Young Jeun ,  O-Seob Jeun ,  Eun-Ho Lee ,  Seung-Won Lim

IPC分类号： H01L23/34

CPC分类号： H01L23/49575 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator has a first surface adjacent to a second surface of the first portion, and a second surface opposite to the first surface of the insulator and exposed to the outside. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit.

摘要翻译： 半导体功率模块包括具有第一电平的第一部分的引线框架和围绕第二部分的第二电平的第二部分和连接到第二部分的多个端子。 半导体功率模块还包括安装在第一部分的第一表面上的电源电路和具有电绝缘性能和导热性的绝缘体。 绝缘体具有与第一部分的第二表面相邻的第一表面和与绝缘体的第一表面相对并暴露于外部的第二表面。 半导体功率模块还包括具有覆盖电源电路的电绝缘性能的密封器。