Invention Grant
- Patent Title: Printed circuit boards and method of producing the same
- Patent Title (中): 印刷电路板及其制造方法
-
Application No.: US11203427Application Date: 2005-08-15
-
Publication No.: US07449791B2Publication Date: 2008-11-11
- Inventor: Yoshinori Wakihara , Kazuhito Yamada
- Applicant: Yoshinori Wakihara , Kazuhito Yamada
- Applicant Address: JP Ibi-gun
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ibi-gun
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: JP8-354971 19961219; JP8-357959 19961227; JP8-357801 19961228; JP9-29587 19970128; JP9-197526 19970723; JP9-197527 19970723
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H05K1/16
Abstract:
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
Public/Granted literature
- US20060032668A1 Printed circuit boards and method of producing the same Public/Granted day:2006-02-16
Information query
IPC分类:
