发明授权
- 专利标题： Solder deposition method and solder bump forming method
- 专利标题（中）： 焊锡沉积法和焊锡凸块成型法
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申请号： US10765931申请日： 2004-01-29
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公开(公告)号： US07452797B2公开(公告)日： 2008-11-18
- 发明人: Youichi Kukimoto , Hitoshi Sakurai , Seishi Kumamoto , Kenshu Oyama
- 申请人： Youichi Kukimoto , Hitoshi Sakurai , Seishi Kumamoto , Kenshu Oyama
- 申请人地址： JP Hyogo
- 专利权人： Harima Chemicals, Inc.
- 当前专利权人： Harima Chemicals, Inc.
- 当前专利权人地址： JP Hyogo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2003-110125 20030415
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
The present invention provides a solder deposition method that includes the step of forming a dam around an electrode on a substrate, the step of applying a solder precipitating composition to the substrate, and the step of depositing solder on the surface of the electrode while heating the solder precipitating composition applied. This solder deposition method is suitable for forming large bumps at fine pitches. In particular, it is capable of depositing solder in a desired height precisely and easily, and yet preventing occurrence of voids.
公开/授权文献
- US20040209451A1 Solder deposition method and solder bump forming method 公开/授权日：2004-10-21
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