公开(公告)号：US07452797B2

公开(公告)日：2008-11-18

申请号：US10765931

申请日：2004-01-29

申请人： Youichi Kukimoto ,  Hitoshi Sakurai ,  Seishi Kumamoto ,  Kenshu Oyama

发明人： Youichi Kukimoto ,  Hitoshi Sakurai ,  Seishi Kumamoto ,  Kenshu Oyama

IPC分类号： H01L21/44

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3484 ,  H05K2203/043 ,  H05K2203/0588 ,  H05K2203/1163 ,  H01L2224/05599

摘要： The present invention provides a solder deposition method that includes the step of forming a dam around an electrode on a substrate, the step of applying a solder precipitating composition to the substrate, and the step of depositing solder on the surface of the electrode while heating the solder precipitating composition applied. This solder deposition method is suitable for forming large bumps at fine pitches. In particular, it is capable of depositing solder in a desired height precisely and easily, and yet preventing occurrence of voids.

摘要翻译： 本发明提供了一种焊料沉积方法，其包括在基板上形成围绕电极的堤坝的步骤，将焊料沉淀组合物施加到基板上的步骤，以及在焊接表面上沉积焊料的步骤，同时加热 焊锡沉淀组合物应用。 这种焊锡沉积方法适用于以细间距形成大的凸块。 特别地，它能够精确且容易地将焊料沉积在所需的高度，并且防止空隙的发生。

公开(公告)号：US20140083567A1

公开(公告)日：2014-03-27

申请号：US14119104

申请日：2011-10-07

申请人： Teruyoshi Hamagawa ,  Youichi Kukimoto ,  Taku Hasegawa ,  Hitoshi Sakurai

发明人： Teruyoshi Hamagawa ,  Youichi Kukimoto ,  Taku Hasegawa ,  Hitoshi Sakurai

IPC分类号： B23K35/02 ,  B23K35/362

CPC分类号： B23K35/025 ,  B23K35/02 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  C08G59/38 ,  C08K3/08 ,  C08K5/09 ,  C08K5/29 ,  C08L63/00 ,  C08L79/04 ,  C22C12/00

摘要： The present invention relates to a soldering paste flux, and the soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups in a molecule, (C) a carboxylic acid having a melting point of 80 to 170° C., and (D) a cyanate ester having two or more cyanato groups in a molecule.

摘要翻译： 本发明涉及一种焊膏助焊剂，焊膏助焊剂包括（A）热固性预聚物，（B）分子中具有三个以上官能团的多官能环氧单体或低聚物，（C）具有 熔点为80〜170℃，（D）分子中具有2个以上氰基的氰酸酯。

公开(公告)号：US20100313081A1

公开(公告)日：2010-12-09

申请号：US12856661

申请日：2010-08-15

申请人： Mie TONOSAKI ,  Hitoshi Sakurai

发明人： Mie TONOSAKI ,  Hitoshi Sakurai

IPC分类号： G06F11/07

CPC分类号： G11C29/88 ,  G11C29/789 ,  G11C29/804

摘要： A cache memory built in a processor comprising a plurality of independent memory blocks, pass/fail information memory unit memorizing a presence/absence of a failure occurring in each of the memory blocks, and a screening control function substituting a sound memory block for a failed memory block based on a memory content in the pass/fail information memory unit.

公开(公告)号：US20100297454A1

公开(公告)日：2010-11-25

申请号：US12746549

申请日：2008-12-08

申请人： Hitoshi Sakurai ,  Satoshi Yuasa ,  Keisuke Nonomura

发明人： Hitoshi Sakurai ,  Satoshi Yuasa ,  Keisuke Nonomura

IPC分类号： C09D5/08 ,  C23F11/00 ,  B32B15/04

CPC分类号： C23C22/05 ,  C04B28/26 ,  C04B2103/0046 ,  C04B2111/00525 ,  C08G2150/90 ,  C09D1/04 ,  C09D5/084 ,  C09D163/00 ,  C23C22/60 ,  C23C22/68 ,  C23C2222/20 ,  Y10T428/31663 ,  C04B24/023 ,  C04B24/281 ,  C04B24/2641 ,  C04B24/282

摘要： A chromium-free treating liquid and treatment methods which are for imparting to a zinc or zinc alloy deposit a coating film which is highly corrosion-resistant, has a uniform appearance free from sag stains/puddle stains, has no failure concerning thickness unevenness, and has satisfactory adhesion. The surface-treating aqueous solution, which is for forming a corrosion-resistant coating film over a zinc or zinc alloy deposit, is characterized by comprising (a) an alkali metal silicate (M2O.nSiO2 (wherein M represents an alkali metal and n indicates SiO2/M2O molar ratio)), (b) a water-soluble or water-dispersible silane coupling agent, and (c) a water-soluble or water-dispersible glycidyl ether compound. One of the surface treatment methods for forming a highly corrosion-resistant coating film over a zinc or zinc alloy deposit includes bringing the surface of the zinc or zinc alloy deposit into contact with the surface-treating aqueous solution. The surface-treating aqueous solution is applicable also to the surface of a chemical conversion coating film formed on a zinc or zinc alloy deposit and free from hexavalent chromium or from chromium in any form. Namely, another surface treatment method for forming a highly corrosion-resistant coating film over a zinc or zinc alloy deposit comprises bringing the surface of a chemical conversion coating film formed on a zinc or zinc alloy deposit into contact with the surface-treating aqueous solution. Furthermore provided is a highly corrosion-resistant coating film formed by bringing the solution into contact with the surface of a zinc or zinc alloy deposit or with the surface of a chemical conversion coating film formed on a zinc or zinc alloy deposit.

摘要翻译： 无铬处理液和用于赋予锌或锌合金的处理方法沉积具有高耐腐蚀性的涂膜，具有没有凹陷污渍/水泥污渍的均匀外观，对于厚度不均匀性没有失败，并且 具有令人满意的粘合力。 用于在锌或锌合金沉积物上形成耐腐蚀涂膜的表面处理水溶液的特征在于包含（a）碱金属硅酸盐（M 2 O·nSiO 2（其中M表示碱金属，n表示 SiO 2 / M 2 O摩尔比）），（b）水溶性或水分散性硅烷偶联剂，和（c）水溶性或水分散性缩水甘油醚化合物。 在锌或锌合金沉积物上形成高耐腐蚀涂膜的表面处理方法之一包括使锌或锌合金沉积物的表面与表面处理水溶液接触。 表面处理水溶液也可用于形成于锌或锌合金沉积物上且不含六价铬或以任何形式的铬形成的化学转化膜的表面。 也就是说，用于在锌或锌合金沉积物上形成高耐腐蚀涂膜的另一种表面处理方法包括使形成在锌或锌合金沉积物上的化学转化膜的表面与表面处理水溶液接触。 此外，还提供了通过使溶液与锌或锌合金沉积物的表面或与锌或锌合金沉积物上形成的化学转化膜的表面接触而形成的高度耐腐蚀的涂膜。

公开(公告)号：US20060026454A1

公开(公告)日：2006-02-02

申请号：US11037002

申请日：2005-01-19

申请人： Mie Tonosaki ,  Hitoshi Sakurai

发明人： Mie Tonosaki ,  Hitoshi Sakurai

IPC分类号： G06F11/00

CPC分类号： G11C29/88 ,  G11C29/789 ,  G11C29/804

摘要： A cache memory built in a processor comprising a plurality of independent memory blocks, pass/fail information memory unit memorizing a presence/absence of a failure occurring in each of the memory blocks, and a screening control function substituting a sound memory block for a failed memory block based on a memory content in the pass/fail information memory unit.

摘要翻译： 内置在包括多个独立存储器块的处理器中的高速缓存存储器，存储每个存储器块中出现的故障的存在/不存在的通过/失败信息存储单元，以及替换声音存储器块以进行故障的屏蔽控制功能 存储块基于通过/失败信息存储单元中的存储器内容。

公开(公告)号：US4889602A

公开(公告)日：1989-12-26

申请号：US186788

申请日：1988-04-25

申请人： Katsuhide Oshima ,  Toshiaki Murai ,  Hitoshi Sakurai ,  Shuji Igarashi ,  Haruo Hanagata ,  Hidesato Igarashi

发明人： Katsuhide Oshima ,  Toshiaki Murai ,  Hitoshi Sakurai ,  Shuji Igarashi ,  Haruo Hanagata ,  Hidesato Igarashi

IPC分类号： C25D3/56

CPC分类号： C25D3/565

摘要： The invention provides an electroplating bath for forming a zinc-nickel alloy coating consisting essentially of water, about 1 to 70 grams/liter of zinc, about 0.6 to 118 grams per liter of nickel, at least one compound from the group consisting of (i) aliphatic amines in an amount not more than 16 grams/liter, (ii) polymers of aliphatic amines in an amount not more than about 20 grams per liter and (iii) a compound selected from the group consisting of hydroxyaliphatic carboxylic acids and salts thereof in an amount from 0 to 2 mols/liter, said bath having a pH of more than 11. The invention also provides an electroplating method for forming a chromate coating on a zinc-nickel alloy coating electrolytically deposited from the electroplating bath defined in the preceding sentence on electrically conductive metalics matrix material, and forming a chromate coating on the zinc-nickel alloy coating by means of a chromate treatment.

摘要翻译： 本发明提供一种用于形成锌 - 镍合金涂层的电镀浴，其基本上由水组成，约1至70克/升锌，约0.6至118克/升镍，至少一种由（i ）脂肪胺，其量不超过16克/升，（ii）脂族胺的聚合物的量不超过约20克/升，和（iii）选自羟基脂族羧酸及其盐的化合物 所述浴的pH值大于11.本发明还提供一种电镀方法，用于在由前述电镀液中定义的电镀浴电沉积的锌 - 镍合金涂层上形成铬酸盐涂层 对导电金属基质材料进行判断，并通过铬酸盐处理在锌 - 镍合金涂层上形成铬酸盐涂层。

公开(公告)号：US07783939B2

公开(公告)日：2010-08-24

申请号：US11037002

申请日：2005-01-19

申请人： Mie Tonosaki ,  Hitoshi Sakurai

发明人： Mie Tonosaki ,  Hitoshi Sakurai

IPC分类号： G11C29/00

CPC分类号： G11C29/88 ,  G11C29/789 ,  G11C29/804

摘要： A cache memory built in a processor comprising a plurality of independent memory blocks, pass/fail information memory unit memorizing a presence/absence of a failure occurring in each of the memory blocks, and a screening control function substituting a sound memory block for a failed memory block based on a memory content in the pass/fail information memory unit.

摘要翻译： 内置在包括多个独立存储器块的处理器中的高速缓存存储器，存储每个存储器块中出现的故障的存在/不存在的通过/失败信息存储单元，以及替换声音存储器块以进行故障的屏蔽控制功能 存储块基于通过/失败信息存储单元中的存储器内容。

公开(公告)号：US20080229011A1

公开(公告)日：2008-09-18

申请号：US12048585

申请日：2008-03-14

申请人： Iwao YAMAZAKI ,  Tsuyoshi Motokurumada ,  Hitoshi Sakurai ,  Hiroyuki Kojima ,  Tomoyuki Okawa

发明人： Iwao YAMAZAKI ,  Tsuyoshi Motokurumada ,  Hitoshi Sakurai ,  Hiroyuki Kojima ,  Tomoyuki Okawa

IPC分类号： G06F12/00

CPC分类号： G06F12/0864 ,  G06F9/3004 ,  G06F9/30087 ,  G06F12/0804 ,  G06F12/0862 ,  G06F12/0897 ,  G06F12/126 ,  G06F2212/2515

摘要： A cache memory unit connecting to a main memory system having a cache memory area in which, if memory data that the main memory system has is registered therewith, the registered memory data is accessed by a memory access instruction that accesses the main memory system and a local memory area with which local data to be used by the processing section is registered and in which the registered local data is accessed by a local memory access instruction, which is different from the memory access instruction.

摘要翻译： 连接到具有高速缓冲存储器区域的主存储器系统的高速缓冲存储器单元，其中如果主存储器系统具有的存储器数据被登记在其中，则通过访问主存储器系统的存储器访问指令访问已登记的存储器数据， 由处理部使用的本地数据被登记在本地存储器区域中，并且通过与存储器访问指令不同的本地存储器访问指令来访问注册的本地数据。

公开(公告)号：US08185699B2

公开(公告)日：2012-05-22

申请号：US12222231

申请日：2008-08-05

申请人： Kumiko Endo ,  Hitoshi Sakurai

发明人： Kumiko Endo ,  Hitoshi Sakurai

IPC分类号： G06F12/00 ,  G06F13/00

CPC分类号： G06F12/0891 ,  G06F12/0804

摘要： In a separating device that separates a processor configured to perform process by using data recorded in a cache memory connected to the processor, a stopping unit, upon receiving a processor separation request, stops the processor from performing a new process; and a separation executing unit, upon completion of process being performed by the processor, separates the processor after invalidating the data recorded in the cache memory.

摘要翻译： 在通过使用记录在连接到处理器的高速缓冲存储器中的数据来分离被配置为执行处理的处理器的分离装置中，停止单元在接收到处理器分离请求时停止处理器执行新处理; 以及分离执行单元，在完成由处理器执行的处理之后，在记录在高速缓冲存储器中的数据无效之后分离处理器。

公开(公告)号：US20080160331A1

公开(公告)日：2008-07-03

申请号：US12038404

申请日：2008-02-27

申请人： Yoichi Kukimoto ,  Kazuki Ikeda ,  Hitoshi Sakurai

发明人： Yoichi Kukimoto ,  Kazuki Ikeda ,  Hitoshi Sakurai

IPC分类号： B23K35/36 ,  B22F7/00 ,  B22F7/02

CPC分类号： B23K35/025 ,  B22F1/007 ,  B23K35/36 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01327 ,  H05K1/111 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/09381 ,  H05K2203/043 ,  Y10T428/12035 ,  Y10T428/12493 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention relates to a solder paste composition used for precoating an electrode surface with solder. A first solder paste composition is contains a solder powder and a flux, and a metallic powder made by metallic species different from metallic species constituting the solder powder and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the solder powder. A second solder paste composition contains a deposition solder material which deposits the solder by heating and a flux, and a metallic powder comprising metallic species different from metallic species constituting a metallic component in the deposition solder material and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the metallic component in the deposition solder material. When these solder paste compositions are evenly applied onto an electronic circuit substrate for precoating, such a solder that does not generate any swollen portion, solder-lacking portion and variability in a height thereof can be formed irrespective of a shape of a pad.

摘要翻译： 本发明涉及一种用于用焊料预涂电极表面的焊膏组合物。 第一焊膏组合物含有焊料粉末和焊剂，以及由构成焊料粉末的金属物质的金属物质构成的金属粉末和构成电极表面的金属物质的比例为0.1重量％以上且20重量％ 或更少的焊锡粉末。 第二焊膏组合物包含通过加热和焊剂沉积焊料的沉积焊料材料和包含金属物质的金属粉末，所述金属粉末包含不同于沉积焊料材料中构成金属成分的金属物质和构成电极表面的金属物质的速率 相对于沉积焊料的金属成分的总量为0.1重量％以上且20重量％以下。 当将这些焊膏组合物均匀地涂覆到用于预涂层的电子电路基板上时，可以形成不产生任何溶胀部分的焊料，焊料缺乏部分和其高度的变化性，而与焊盘的形状无关。