Invention Grant
US07456022B2 Solid support having ligand immobilized thereon by using photocleavable linker
有权
通过使用可光致发光的接头,其上固定有配体的固体支持物
- Patent Title: Solid support having ligand immobilized thereon by using photocleavable linker
- Patent Title (中): 通过使用可光致发光的接头,其上固定有配体的固体支持物
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Application No.: US11572972Application Date: 2005-07-28
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Publication No.: US07456022B2Publication Date: 2008-11-25
- Inventor: Masayuki Haramura , Akito Tanaka
- Applicant: Masayuki Haramura , Akito Tanaka
- Applicant Address: JP Tokyo
- Assignee: Reverse Proteomics Research Institute Co., Ltd.
- Current Assignee: Reverse Proteomics Research Institute Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2004-224634 20040730
- International Application: PCT/JP2005/014266 WO 20050728
- International Announcement: WO2006/011673 WO 20060202
- Main IPC: B01J20/26
- IPC: B01J20/26 ; G01N33/547

Abstract:
The present invention provides a method of analyzing the interaction between a ligand and a target molecule, which uses a solid support wherein the ligand is immobilized via a linker cleavable by photoirradiation, particularly a method of searching and purifying a target molecule. By intervening a linker specifically cleavable by photoirradiation between the ligand molecule and the solid support, release and elution of the target molecule from the solid support without using a ligand or salt at a high concentration can be enabled, and suppression of release and elution of a nonspecific protein can be enabled.
Public/Granted literature
- US20070212731A1 Solid Support Having Ligand Immobilized Thereon By Using Photocleavable Linker Public/Granted day:2007-09-13
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