发明授权
- 专利标题： Sealing porous dielectrics with silane coupling reagents
- 专利标题（中）： 用硅烷偶联剂密封多孔电介质
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申请号： US11516410申请日： 2006-09-05
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公开(公告)号： US07456490B2公开(公告)日： 2008-11-25
- 发明人: Grant Kloster , Chih-I Wu , Xiaorong Morrow
- 申请人： Grant Kloster , Chih-I Wu , Xiaorong Morrow
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H01L23/48 ; H01L23/52
摘要：
A method and structure for sealing porous dielectrics using silane coupling reagents is herein described. A sealant chain (silane coupling reagent) is formed from at least silicon, carbon, oxygen, and hydrogen and exposed to a porous dielectric material, wherein the sealant chain reacts with a second chain, that has at least oxygen and is present in the porous dielectric defining the pores, to form a continuous layer over the surface of the porous dielectric.
公开/授权文献
- US20070066079A1 Sealing porous dielectrics with silane coupling reagents 公开/授权日：2007-03-22
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