Invention Grant
- Patent Title: Wafer probe
- Patent Title (中): 晶圆探针
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Application No.: US11975175Application Date: 2007-10-18
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Publication No.: US07456646B2Publication Date: 2008-11-25
- Inventor: Leonard Hayden , John Martin , Mike Andrews
- Applicant: Leonard Hayden , John Martin , Mike Andrews
- Applicant Address: US OR Beaverton
- Assignee: Cascade Microtech, Inc.
- Current Assignee: Cascade Microtech, Inc.
- Current Assignee Address: US OR Beaverton
- Agency: Chernoff, Vilhauer, McClung & Stenzel
- Main IPC: G01R1/073
- IPC: G01R1/073 ; H01L21/00
Abstract:
The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.
Public/Granted literature
- US20080042677A1 Wafer probe Public/Granted day:2008-02-21
Information query
