发明授权
- 专利标题： Flexible substrate and electronic equipment
- 专利标题（中）： 柔性基板和电子设备
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申请号： US11077392申请日： 2005-03-10
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公开(公告)号： US07456701B2公开(公告)日： 2008-11-25
- 发明人: Keitaro Fujimori , Mihiro Nonoyama , Yukinari Shibata , Yoshiteru Ono , Hiroyasu Honda , Yoshiro Iwasa
- 申请人： Keitaro Fujimori , Mihiro Nonoyama , Yukinari Shibata , Yoshiteru Ono , Hiroyasu Honda , Yoshiro Iwasa
- 申请人地址： JP
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： JP2004-070990 20040312
- 主分类号： G06F13/00
- IPC分类号： G06F13/00 ; H03H7/38
摘要：
A flexible substrate including: a first part provided with a first device DV1; a second part provided with a second device; a wiring part placed between the first part and the second part and including a plurality of wirings for coupling the first device and the second device; the first device including at least a first data transfer control unit, the second device including at least a second data transfer control unit, the first data transfer control unit and the second data transfer control unit transferring data by using a differential signal, and the plurality of wirings for coupling the first device and the second device including at least one differential signal line pair for transferring data by using a differential signal.
公开/授权文献
- US20050200413A1 Flexible substrate and electronic equipment 公开/授权日：2005-09-15
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