Invention Grant
- Patent Title: Film-shaped adhesive application apparatus
- Patent Title (中): 薄膜状粘合剂涂布装置
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Application No.: US11617666Application Date: 2006-12-28
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Publication No.: US07459046B2Publication Date: 2008-12-02
- Inventor: Hiroyuki Kumakura , Yukio Yamada
- Applicant: Hiroyuki Kumakura , Yukio Yamada
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,Sony Chemical & Information Device Corporation
- Current Assignee: Sony Corporation,Sony Chemical & Information Device Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2002-083288 20020325
- Main IPC: B32B41/00
- IPC: B32B41/00

Abstract:
A film-shaped adhesive application apparatus includes a supply reel retainer for mounting a film-shaped adhesive supply reel used to wind into a roll shape a film-shaped adhesive 1 comprising a base film and an adhesive layer formed thereon, thermocompression bonding means for thermocompression-bonding the film-shaped adhesive drawn from the film-shaped adhesive supply reel to an adherend, and a winding reel retainer for mounting a winding reel used to wind the base film of the thermocompression-bonded film-shaped adhesive, and further temperature control means (thermal shield plate, cooler, or the like) for controlling the film-shaped adhesive supply reel mounted on the supply reel retainer at a prescribed temperature.
Public/Granted literature
- US20070102105A1 FILM-SHAPED ADHESIVE APPLICATION APPARATUS Public/Granted day:2007-05-10
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