Invention Grant
- Patent Title: Mold core having a temperature control apparatus
- Patent Title (中): 模芯具有温度控制装置
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Application No.: US11433244Application Date: 2006-05-12
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Publication No.: US07462026B2Publication Date: 2008-12-09
- Inventor: Jhy-Chain Lin
- Applicant: Jhy-Chain Lin
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Steven M. Reiss
- Priority: CN200510035286 20050610
- Main IPC: B29C45/72
- IPC: B29C45/72

Abstract:
An temperature control apparatus includes a temperature detecting element (50), a control circuit (60), and a thermoelectric unit (70). The temperature detecting element contacts to a first surface (82) of a predetermined target (800). The control circuit is electrically connected to the temperature detecting element. The thermoelectric unit is electrically connected to the control circuit, and contacts a second surface of the predetermined target. The temperature detecting element detects a temperature signal. The temperature signal is input into the control circuit. The control circuit changes the temperature signal into an electrical current signal, and the electrical current signal drives the thermoelectric unit to control the temperature of the predetermined target.
Public/Granted literature
- US20060278264A1 Temperature control apparatus Public/Granted day:2006-12-14
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