发明授权
- 专利标题： Microelectromechanical component and method for the production thereof
- 专利标题（中）： 微机电部件及其制造方法
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申请号： US10558114申请日： 2004-05-24
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公开(公告)号： US07462919B2公开(公告)日： 2008-12-09
- 发明人: Thomas Engling , Martin Petz
- 申请人： Thomas Engling , Martin Petz
- 申请人地址： DE Munich
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Munich
- 代理机构： Dicke, Billig, Czaja PLLC
- 优先权： DE10324139 20030526
- 国际申请： PCT/DE2004/001080 WO 20040524
- 国际公布： WO2004/106222 WO 20041209
- 主分类号： H01L29/84
- IPC分类号： H01L29/84
摘要：
A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip, which is covered in its pressure-sensitive region by a rubber-elastic layer and is arranged in a cavity housing and covered by a rubber-elastic covering. This rubber-elastic covering has a greater thickness than the rubber-elastic layer on the pressure-sensitive region.
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