公开(公告)号：US07462919B2

公开(公告)日：2008-12-09

申请号：US10558114

申请日：2004-05-24

申请人： Thomas Engling ,  Martin Petz

发明人： Thomas Engling ,  Martin Petz

IPC分类号： H01L29/84

CPC分类号： B81B7/0058 ,  B81B2201/0264 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip, which is covered in its pressure-sensitive region by a rubber-elastic layer and is arranged in a cavity housing and covered by a rubber-elastic covering. This rubber-elastic covering has a greater thickness than the rubber-elastic layer on the pressure-sensitive region.

摘要翻译： 公开了一种微机电部件及其制造方法。 在一个实施例中，微电子机械部件具有压敏半导体芯片，该压敏半导体芯片通过橡胶弹性层在其压敏区域被覆盖，并且被布置在腔室中并由橡胶弹性覆盖物覆盖。 该橡胶弹性覆盖物的厚度比压敏区域上的橡胶弹性层厚。

公开(公告)号：US20050104149A1

公开(公告)日：2005-05-19

申请号：US10956087

申请日：2004-10-04

申请人： Michael Bauer ,  Thomas Engling ,  Alfred Haimerl ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Thomas Engling ,  Alfred Haimerl ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L23/66 ,  H01L25/10 ,  H01L31/0203

CPC分类号： H01L23/66 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49855 ,  H01L24/48 ,  H01L25/105 ,  H01L31/0203 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to a semiconductor component and a sensor component with data transmission devices, for wireless transmission the semiconductor component having a main coupling element and the sensor component having a sensor coupling element. The invention affords the possibility of multiple sensor applications without direct electrical contact between sensor component and semiconductor component, which may have a logic chip.

摘要翻译： 本发明涉及具有数据传输装置的半导体部件和传感器部件，用于无线传输半导体部件具有主耦合元件，传感器部件具有传感器耦合元件。 本发明提供了传感器组件和可能具有逻辑芯片的半导体组件之间没有直接电接触的多个传感器应用的可能性。

公开(公告)号：US20070090473A1

公开(公告)日：2007-04-26

申请号：US10558114

申请日：2004-05-24

申请人： Thomas Engling ,  Martin Petz

发明人： Thomas Engling ,  Martin Petz

IPC分类号： H01L29/82 ,  H01L27/14 ,  H01L29/84 ,  H01L21/00

CPC分类号： B81B7/0058 ,  B81B2201/0264 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip, which is covered in its pressure-sensitive region by a rubber-elastic layer and is arranged in a cavity housing and covered by a rubber-elastic covering. This rubber-elastic covering has a greater thickness than the rubber-elastic layer on the pressure-sensitive region.

摘要翻译： 公开了一种微机电部件及其制造方法。 在一个实施例中，微电子机械部件具有压敏半导体芯片，该压敏半导体芯片通过橡胶弹性层在其压敏区域被覆盖，并且被布置在腔室中并由橡胶弹性覆盖物覆盖。 该橡胶弹性覆盖物的厚度比压敏区域上的橡胶弹性层厚。

公开(公告)号：US20100207277A1

公开(公告)日：2010-08-19

申请号：US10598143

申请日：2005-02-09

申请人： Michael Bauer ,  Thomas Engling ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Thomas Engling ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L25/11 ,  H01L21/50

CPC分类号： H01L23/538 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.

摘要翻译： 公开了一种包括半导体芯片的堆叠的半导体部件，半导体芯片一体地固定在另一个之上。 半导体芯片的接触区域被引导直到半导体芯片和导体部分的边缘至少从半导体芯片的边缘侧的上边缘延伸到下边缘，以便电连接半导体芯片的接触区域 堆叠的半导体芯片彼此。

公开(公告)号：US08354299B2

公开(公告)日：2013-01-15

申请号：US10598143

申请日：2005-02-09

申请人： Michael Bauer ,  Thomas Engling ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Thomas Engling ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L21/44

CPC分类号： H01L23/538 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.

摘要翻译： 公开了一种包括半导体芯片的堆叠的半导体部件，半导体芯片一体地固定在另一个之上。 半导体芯片的接触区域被引导直到半导体芯片和导体部分的边缘至少从半导体芯片的边缘侧的上边缘延伸到下边缘，以便电连接半导体芯片的接触区域 堆叠的半导体芯片彼此。

公开(公告)号：US07230309B2

公开(公告)日：2007-06-12

申请号：US10956087

申请日：2004-10-04

申请人： Michael Bauer ,  Thomas Engling ,  Alfred Haimerl ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Thomas Engling ,  Alfred Haimerl ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L31/0203

CPC分类号： H01L23/66 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49855 ,  H01L24/48 ,  H01L25/105 ,  H01L31/0203 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to a semiconductor component and a sensor component with data transmission devices, for wireless transmission the semiconductor component having a main coupling element and the sensor component having a sensor coupling element. The invention affords the possibility of multiple sensor applications without direct electrical contact between sensor component and semiconductor component, which may have a logic chip.

摘要翻译： 本发明涉及具有数据传输装置的半导体部件和传感器部件，用于无线传输半导体部件具有主耦合元件，传感器部件具有传感器耦合元件。 本发明提供了传感器组件和可能具有逻辑芯片的半导体组件之间没有直接电接触的多个传感器应用的可能性。