Invention Grant
US07466008B2 BiCMOS performance enhancement by mechanical uniaxial strain and methods of manufacture
有权
通过机械单轴应变的BiCMOS性能提高和制造方法
- Patent Title: BiCMOS performance enhancement by mechanical uniaxial strain and methods of manufacture
- Patent Title (中): 通过机械单轴应变的BiCMOS性能提高和制造方法
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Application No.: US11717484Application Date: 2007-03-13
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Publication No.: US07466008B2Publication Date: 2008-12-16
- Inventor: Chih-Hsin Ko , Tzu-Juei Wang , Hung-Wei Chen , Chung-Hu Ke , Wen-Chin Lee
- Applicant: Chih-Hsin Ko , Tzu-Juei Wang , Hung-Wei Chen , Chung-Hu Ke , Wen-Chin Lee
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L27/07

Abstract:
A BiCMOS device with enhanced performance by mechanical uniaxial strain is provided. A first embodiment of the present invention includes an NMOS transistor, a PMOS transistor, and a bipolar transistor formed on different areas of the substrate. A first contact etch stop layer with tensile stress is formed over the NMOS transistor, and a second contact etch stop layer with compressive stress is formed over the PMOS transistor and the bipolar transistor, allowing for an enhancement of each device. Another embodiment has, in addition to the stressed contact etch stop layers, strained channel regions in the PMOS transistor and the NMOS transistor, and a strained base in the BJT.
Public/Granted literature
- US20080224227A1 BiCMOS performance enhancement by mechanical uniaxial strain and methods of manufacture Public/Granted day:2008-09-18
Information query
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