发明授权
US07473587B2 High-quality SGOI by oxidation near the alloy melting temperature
有权
高品质的SGOI通过氧化在合金熔化温度附近
- 专利标题: High-quality SGOI by oxidation near the alloy melting temperature
- 专利标题(中): 高品质的SGOI通过氧化在合金熔化温度附近
-
申请号: US11029921申请日: 2005-01-05
-
公开(公告)号: US07473587B2公开(公告)日: 2009-01-06
- 发明人: Stephen W. Bedell , Anthony G. Domenicucci , Keith E. Fogel , Devendra K. Sadana
- 申请人: Stephen W. Bedell , Anthony G. Domenicucci , Keith E. Fogel , Devendra K. Sadana
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Scully, Scott, Murphy & Presser, P.C.
- 代理商 Robert M. Trepp, Esq.
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L21/44
摘要:
A method of forming a low-defect, substantially relaxed SiGe-on-insulator substrate material is provided. The method includes first forming a Ge-containing layer on a surface of a first single crystal Si layer which is present atop a barrier layer that is resistant to Ge diffusion. A heating step is then performed at a temperature that approaches the melting point of the final SiGe alloy and retards the formation of stacking fault defects while retaining Ge. The heating step permits interdiffusion of Ge throughout the first single crystal Si layer and the Ge-containing layer thereby forming a substantially relaxed, single crystal SiGe layer atop the barrier layer. Moreover, because the heating step is carried out at a temperature that approaches the melting point of the final SiGe alloy, defects that persist in the single crystal SiGe layer as a result of relaxation are efficiently annihilated therefrom.
公开/授权文献
信息查询
IPC分类: