Invention Grant
US07476570B2 System and method of attaching an integrated circuit assembly to a printed wiring board
失效
将集成电路组件附接到印刷电路板的系统和方法
- Patent Title: System and method of attaching an integrated circuit assembly to a printed wiring board
- Patent Title (中): 将集成电路组件附接到印刷电路板的系统和方法
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Application No.: US11381290Application Date: 2006-05-02
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Publication No.: US07476570B2Publication Date: 2009-01-13
- Inventor: Lance L. Sundstrom
- Applicant: Lance L. Sundstrom
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Fogg & Powers LLC
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method of coupling an integrated circuit (IC) assembly to a printed wiring board (PWB) is provided. The method comprises applying a solder paste to at least one IC assembly interfacial attach pad having a first size on a surface of the IC assembly and applying a solder paste to at least one PWB interfacial attach pad having a second size on a surface of the PWB. The method also comprises reflow attaching the at least one IC assembly interfacial attach pad to the at least one PWB interfacial attach pad, wherein the difference between the size of the at least one PWB interfacial attach pad and the size of the at least one IC assembly interfacial attach pad substantially inhibits self-alignment and lift-off forces.
Public/Granted literature
- US20070259480A1 SYSTEM AND METHOD OF ATTACHING AN INTEGRATED CIRCUIT ASSEMBLY TO A PRINTED WIRING BOARD Public/Granted day:2007-11-08
Information query
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