公开(公告)号：US08748750B2

公开(公告)日：2014-06-10

申请号：US13179091

申请日：2011-07-08

Applicant: Lance L. Sundstrom ,  Michael J. Gillespie ,  Rainer Blomberg

Inventor： Lance L. Sundstrom ,  Michael J. Gillespie ,  Rainer Blomberg

IPC: H05K1/16

CPC classification number: H05K1/0207 ,  H05K3/3421 ,  H05K2201/09036 ,  H05K2201/10689 ,  Y10T29/49124

Abstract: Example printed board assembly (PBA) interfaces are described. In some examples, the disclosure relates to a printed board (PB) including a conductive layer, where the PB defines a first surface and a recess in the first surface, where a surface defining the recess is at least one of electrically or thermally connected to the conductive layer, and an electrical component body mounted on the PB. The electrical component body may be mounted on the PB such that a surface of the electrical component body extends over at least a portion of the recess, where the recess extends beyond the electrical component body such that the recess defines an aperture for introducing an interface material between the surface of the electrical component body and the surface of the recess.

Abstract translation: 描述了印刷电路板组件（PBA）接口。 在一些示例中，本公开涉及包括导电层的印刷电路板（PB），其中PB限定第一表面和第一表面中的凹部，其中限定凹部的表面至少一个电或热连接到 导电层，以及安装在PB上的电气元件体。 电气部件主体可以安装在PB上，使得电气部件主体的表面在凹部的至少一部分上延伸，其中凹部延伸超出电气部件主体，使得凹部限定用于引入界面材料的孔 在电气部件主体的表面和凹部的表面之间。

公开(公告)号：US08094490B1

公开(公告)日：2012-01-10

申请号：US12461228

申请日：2009-08-05

Applicant: Lance L. Sundstrom

Inventor： Lance L. Sundstrom

IPC: G11C11/14

CPC classification number: G11C11/155

Abstract: A nonvolatile loop magnetic memory having a magnetically writeable nonvolatile magnetic memory element and a loop magnetic shunt. The loop magnetic shunt has a slot through a loop of the loop magnetic shunt, the slot forming first and second ends in the loop magnetic shunt, the first and second ends arranged to focus a magnetic field on the magnetically writeable nonvolatile magnetic memory element. The magnetically writeable nonvolatile magnetic memory element is located between the first and second ends of the loop magnetic shunt. A magnetic write coil is wrapped around the loop magnetic shunt.

Abstract translation: 一种具有可写磁性非易失性磁存储元件和环形磁分路的非易失循环磁存储器。 环路分路器具有通过环路分路的环路的槽，槽形成环路分路中的第一和第二端，第一和第二端被布置成将磁场聚焦在可磁性写入的非易失性磁性存储元件上。 可写磁性非易失性磁存储元件位于回路磁分路的第一和第二端之间。 磁性写入线圈缠绕在环路分路上。

公开(公告)号：US5764498A

公开(公告)日：1998-06-09

申请号：US882320

申请日：1997-06-25

Applicant: Lance L. Sundstrom

Inventor： Lance L. Sundstrom

IPC: F16F15/04 ,  H05K3/30 ,  F16M13/00 ,  F16F15/00

CPC classification number: F16F15/04 ,  H05K3/301 ,  Y10T29/49615

Abstract: An electronics assembly is described which allows three-dimensional movement of a printed wiring board (PWB) relative to an attached electronics subassembly. The subassembly is attached to the PWB by a coupling device which is capable of resilient deflection responsive to mechanical agitation while maintaining effective electrical and thermal communication between the subassembly and the PWB. The coupling device includes contact surfaces which enhance the reliability of the overall electronics assembly by minimizing the potential for detachment of the subassembly from the PWB.

Abstract translation: 描述了允许印刷电路板（PWB）相对于附接的电子部件的三维运动的电子组件。 子组件通过耦合装置连接到PWB，联接装置能够响应于机械搅动而具有弹性偏转，同时保持子组件和PWB之间的有效的电和热连通。 联接装置包括接触表面，其通过最小化子组件与PWB分离的可能性来增强整个电子组件的可靠性。

公开(公告)号：US5602494A

公开(公告)日：1997-02-11

申请号：US401604

申请日：1995-03-09

Applicant: Lance L. Sundstrom

Inventor： Lance L. Sundstrom

IPC: H03K19/0185 ,  H03K19/0175

CPC classification number: H03K19/018592 ,  H03K19/018585

Abstract: A bi-directional programmable I/O cell is disclosed. The bi-directional programmable I/O cell has variable electrical characteristics which are selected via control inputs. The variable electrical characteristics can include a data transmission mode, an input bias impedance value and an input bias direction mode. The input bias direction mode has an independent submode and a dependent submode. The dependent submode can operate in a ring latch mode or an active termination mode. The independent submode is further comprised of a static submode and a dynamic submode. The static submode is further comprised of a pull-up mode and a pull-down mode. The bias impedance value is can be selected from a plurality of impedances. The bi-directional programmable I/O cell has a continuous or pulsed output in the data transmission mode.

Abstract translation: 公开了一种双向可编程I / O单元。 双向可编程I / O单元具有通过控制输入选择的可变电气特性。 可变电气特性可以包括数据传输模式，输入偏置阻抗值和输入偏置方向模式。 输入偏置方向模式具有独立的子模式和依赖子模式。 依赖子模式可以以环形锁存模式或主动终止模式工作。 独立子模式还包括静态子模式和动态子模式。 静态子模式还包括上拉模式和下拉模式。 偏置阻抗值可以从多个阻抗中选择。 双向可编程I / O单元在数据传输模式下具有连续或脉冲输出。

公开(公告)号：US20110215891A1

公开(公告)日：2011-09-08

申请号：US12716876

申请日：2010-03-03

Applicant: Lance L. Sundstrom ,  Wiclyff T. Bonga ,  Michael J. Gillespie

Inventor： Lance L. Sundstrom ,  Wiclyff T. Bonga ,  Michael J. Gillespie

IPC: H01F27/06 ,  H01F27/04 ,  H01F41/00

CPC classification number: H01F27/04 ,  H01F27/06 ,  H01F41/00 ,  Y10T29/49073

Abstract: An assembly includes a toroidal induction component, a potting cup, and potting material. The toroidal induction component includes a conductive winding, where at least ends of the conductive winding define a lead set of the toroidal induction component. The potting cup is configured to accept the toroidal induction component and its lead set. Techniques for forming the assembly are also described.

Abstract translation: 组件包括环形感应部件，灌封杯和灌封材料。 环形感应部件包括导电绕组，其中导电绕组的至少端限定环形感应部件的引线组。 灌封杯配置为接受环形感应元件及其引线组。 还描述了用于形成组件的技术。

公开(公告)号：US08009429B1

公开(公告)日：2011-08-30

申请号：US12728947

申请日：2010-03-22

Applicant: Lance L. Sundstrom ,  Rainer Blomberg ,  Michael J. Gillespie

Inventor： Lance L. Sundstrom ,  Rainer Blomberg ,  Michael J. Gillespie

IPC: H05K7/20

CPC classification number: H01L23/42 ,  H01L23/36 ,  H01L2924/0002 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Thermal management features are described for use with electrical components. In some examples, an assembly includes a printed board that includes a thermally conductive thermal attach pad thermally connected to a heat sink, an electrically conductive attach pad that is separate from the thermally conductive attach pad, and an electrically conductive trace electrically connected to the electrically conductive attach pad. An electrical component can be electrically connected to the electrically conductive attach pad and the electrically conductive trace of the printed board. A thermal interface material is disposed adjacent at least a portion of a side surface of the electrical component and in contact with the thermally conductive attach pad. In this manner, the assembly may provide a thermally conductive pathway from an electrical component to the heat sink.

Abstract translation: 热管理功能被描述为与电气部件一起使用。 在一些示例中，组件包括印刷板，其包括热连接到散热器的导热热附接垫，与导热附接垫分离的导电附接垫，以及电连接到电导 导电连接垫。 电气部件可以电连接到导电附接焊盘和印刷电路板的导电迹线。 热界面材料邻近电气部件的侧表面的至少一部分设置并与导热附接垫接触。 以这种方式，组件可以提供从电气部件到散热器的导热路径。

公开(公告)号：US07724566B1

公开(公告)日：2010-05-25

申请号：US12230282

申请日：2008-08-27

Applicant: Lance L. Sundstrom

Inventor： Lance L. Sundstrom

IPC: G11C11/00

CPC classification number: G11C11/1675 ,  G11C11/161

Abstract: A magnetoresistive resistor memory cell having four individually polarizable magnetoresistive resistors that form a magnetoresistive bridge circuit. Each of the four magnetoresistive resistors is surrounded by a write trace segment pair. One upper write trace segment is directly above a magnetoresistive resistor and one lower write trace segment is directly below that resistor. The two write traces of a write trace segment pair are oriented at 90 degrees relative to the anisotropic axis, that is, the length, of the magnetoresistive resistor. The combination of the magnetoresistive resistor bridge circuit and four write trace segment pairs forms a magnetoresistive resistor memory cell.

Abstract translation: 具有四个单独可极化的磁阻电阻器的磁阻电阻存储单元形成磁阻桥电路。 四个磁阻电阻中的每一个被写入跟踪段对包围。 一个上部写入跟踪段直接位于磁阻电阻上方，一个下部写入跟踪段直接位于该电阻下方。 写入跟踪段对的两个写入迹线相对于各向异性轴定向成90度，即磁阻电阻器的长度。 磁阻电阻桥电路和四个写跟踪段对的组合形成磁阻电阻存储单元。

公开(公告)号：US07016176B1

公开(公告)日：2006-03-21

申请号：US11100872

申请日：2005-04-07

Applicant: Lance L. Sundstrom

Inventor： Lance L. Sundstrom

IPC: H01G4/228

CPC classification number: H01G4/232 ,  H01G2/065 ,  Y10T29/43 ,  Y10T29/435

Abstract: A chip capacitor that includes a first and second terminal and a plurality of first and second conductive plates. The first terminal has a first interfacial attachment area that is adapted to be attached to a host substrate. The second terminal has a second interfacial attachment area also adapted to be attached to a host substrate. The first interfacial attachment area and the second interfacial attachment area separated by at least one relatively thin isolation strip such that the first and second interfacial attachment areas generally approach covering the entire attaching area of the chip capacitor. The plurality of first conductive plates are coupled to the first terminal and the plurality of second plates are coupled to the second terminal. In one embodiment, approximately 50% of the periphery of each first and second conductive plate is coupled to the respective first and second terminals.

Abstract translation: 一种片状电容器，包括第一和第二端子以及多个第一和第二导电板。 第一端子具有适于附接到主体衬底的第一界面附接区域。 第二端子具有也适于附接到主机基板的第二界面附接区域。 第一界面附着区域和第二界面附着区域由至少一个相对薄的隔离带隔开，使得第一和第二界面附着区域通常覆盖覆盖片状电容器的整个附着区域。 多个第一导电板耦合到第一端子，并且多个第二板耦合到第二端子。 在一个实施例中，每个第一和第二导电板的大约50％的周边耦合到相应的第一和第二端子。

公开(公告)号：US07557425B2

公开(公告)日：2009-07-07

申请号：US11130744

申请日：2005-05-17

Applicant: Lance L. Sundstrom

Inventor： Lance L. Sundstrom

IPC: H01L29/00

CPC classification number: H01L23/642 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/00

Abstract: An integrated circuit package is provided. The package comprises a lid which is adapted to cover an integrated circuit, the lid is further adapted to provide bypass capacitance to the integrated circuit.

Abstract translation: 提供集成电路封装。 封装包括适于覆盖集成电路的盖，盖还适于向集成电路提供旁路电容。

公开(公告)号：US07476570B2

公开(公告)日：2009-01-13

申请号：US11381290

申请日：2006-05-02

Applicant: Lance L. Sundstrom

Inventor： Lance L. Sundstrom

IPC: H01L21/00

CPC classification number: H05K3/341 ,  H05K1/141 ,  H05K3/3421 ,  H05K2201/10378 ,  H05K2201/10689 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2201/10984 ,  Y02P70/613

Abstract: A method of coupling an integrated circuit (IC) assembly to a printed wiring board (PWB) is provided. The method comprises applying a solder paste to at least one IC assembly interfacial attach pad having a first size on a surface of the IC assembly and applying a solder paste to at least one PWB interfacial attach pad having a second size on a surface of the PWB. The method also comprises reflow attaching the at least one IC assembly interfacial attach pad to the at least one PWB interfacial attach pad, wherein the difference between the size of the at least one PWB interfacial attach pad and the size of the at least one IC assembly interfacial attach pad substantially inhibits self-alignment and lift-off forces.

Abstract translation: 提供了一种将集成电路（IC）组件耦合到印刷电路板（PWB）的方法。 该方法包括将焊膏施加到IC组件的表面上具有第一尺寸的至少一个IC组件界面附接垫，并将焊膏施加到PWB的表面上的至少一个具有第二尺寸的PWB界面连接垫 。 该方法还包括将至少一个IC组装界面附着垫重新焊接到至少一个PWB界面附接垫上，其中至少一个PWB界面附着垫的尺寸与至少一个IC组件的尺寸之间的差异 界面附着垫基本上抑制自对准和剥离力。