发明授权
US07479254B2 Application using non-covalent bond between a cucurbituril derivative and a ligand
有权
在葫芦巴衍生物和配体之间使用非共价键的应用
- 专利标题: Application using non-covalent bond between a cucurbituril derivative and a ligand
- 专利标题(中): 在葫芦巴衍生物和配体之间使用非共价键的应用
-
申请号: US11407143申请日: 2006-04-20
-
公开(公告)号: US07479254B2公开(公告)日: 2009-01-20
- 发明人: Kimoon Kim , Kangkyun Baek , Jeeyeon Kim , Iiha Hwang , Young Ho Ko , Narayanan Selvapalam , Erumaipatty R. Nagarajan , Kyeng Min Park
- 申请人: Kimoon Kim , Kangkyun Baek , Jeeyeon Kim , Iiha Hwang , Young Ho Ko , Narayanan Selvapalam , Erumaipatty R. Nagarajan , Kyeng Min Park
- 申请人地址: KR Pohang KR Pohang
- 专利权人: Postech Foundation,Postech Academy-Industry Foundation
- 当前专利权人: Postech Foundation,Postech Academy-Industry Foundation
- 当前专利权人地址: KR Pohang KR Pohang
- 代理机构: Rothwell, Figg, Ernst & Manbeck
- 优先权: KR10-2005-0099379 20051020; KR10-2005-0108312 20051112; KR10-2006-0000891 20060104; KR10-2006-0018434 20060224
- 主分类号: B01L3/00
- IPC分类号: B01L3/00 ; A61K9/36 ; A61K45/00 ; C12Q1/68 ; G01N15/06 ; G01N33/53
摘要:
Provided are a kit including a first component that is a compound of formula (1) below bound to a first material and a second component that is a ligand bound to a second material, wherein each of the first and second materials is independently selected from the group consisting of a solid phase, a biomolecule, an antioxidant, a chemical therapeutic agent, an anti-histaminic agent, a cucurbituril dendrimer, a cyclodextrin derivative, a crown ether derivative, a calixarene derivative, a cyclophane derivative, a cyclic peptide derivative, a metallic ion, a chromophore, a fluorescent material, a phosphor, a radioactive material, and a catalyst; and the ligand can non-covalently bind to the compound of formula (1); a method of separating and purifying a material bound to a ligand using the compound of formula (1) bound to a solid phase; a method of separating and purifying the compound of formula (1) or a material bound to the compound using a ligand bound to a solid phase; a sensor chip including a compound of formula (1) bound to a first material and a ligand bound to a second material; and a solid-catalyst complex including the compound of formula (1) bound to a first material and a ligand bound to a second material.
公开/授权文献
信息查询
IPC分类: