Invention Grant
- Patent Title: Electronic device and method of manufacturing the same
- Patent Title (中): 电子设备及其制造方法
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Application No.: US11024469Application Date: 2004-12-30
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Publication No.: US07482648B2Publication Date: 2009-01-27
- Inventor: Wenxu Xianyu , Takashi Noguchi , In-kyeong Yoo , Young-soo Park
- Applicant: Wenxu Xianyu , Takashi Noguchi , In-kyeong Yoo , Young-soo Park
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR2003-100399 20031230
- Main IPC: H01L31/119
- IPC: H01L31/119

Abstract:
In an electronic device, and a method of manufacturing the same, the electronic device includes a first substrate, a first lower capacitor on the first substrate, a first lower switching element on the first lower capacitor, and a second substrate on the first lower switching element. The electronic device may further include a second lower switching element which is isolated from the first lower capacitor, and an upper capacitor on the second substrate, the lower electrode of the upper capacitor being connected to the second lower switching element.
Public/Granted literature
- US20050139882A1 Electronic device and method of manufacturing the same Public/Granted day:2005-06-30
Information query
IPC分类: