发明授权
- 专利标题: Headphone apparatus
- 专利标题(中): 耳机设备
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申请号: US11540829申请日: 2006-09-29
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公开(公告)号: US07489795B2公开(公告)日: 2009-02-10
- 发明人: Tomohiro Ito
- 申请人: Tomohiro Ito
- 申请人地址: JP
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP
- 代理机构: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 优先权: JPP2001-264601 20010831
- 主分类号: H04R25/00
- IPC分类号: H04R25/00
摘要:
In order to construct a headphone composed of a housing which holds a driver unit and an arm attached to the housing easily and favorably, a driver unit driven by an inputted audio signal, a housing 110 that therein accommodates the driver unit and has on its periphery a first flange portion for attaching an ear pad on the outside and an arm connected to the housing are provided. Then, a second flange portion that is connected to the first flange portion on the housing side is provided so that both the flange portion on the housing side and the flange portion on the arm side function as a flange for attaching an ear pad and also both the flange portions hold the driver unit when the arm is joined to the housing.
公开/授权文献
- US20070025578A1 Headphone apparatus 公开/授权日:2007-02-01
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