An RC receiver device and an ambient light photosensor (ALPS) device are mounted on a single mounting device (e.g., circuit board or lead frame substrate) such that they are part of a single composite assembly. This reduces the amount of space that is consumed in electronic devices in which the assemblies are installed, which allows the electronic devices to be made smaller in size. In addition, implementing both the RC receiver device and the ALPS device in a single composite assembly lowers costs associated with manufacturing, assembling and shipping the composite assembly.