摘要:
Disclosed are various embodiments of an infrared proximity sensor package comprising an infrared transmitter die, an infrared receiver die, a housing comprising sidewalls, a first recess, a second recess, a partitioning divider disposed between the first and second recesses, and an overlying shield comprising an infrared-absorbing material. The transmitter die is positioned in the first recess, and the receiver die is positioned within the second recess. The partitioning divider comprises liquid crystal polymer (LCP) such that the partitioning divider and the infrared-absorbing material of the shield cooperate together to substantially attenuate and absorb undesired infrared light that might otherwise become internally-reflected within the housing or incident upon the receiver as a false proximity or object detection signal.
摘要:
An optical proximity sensor and housing for the same are disclosed. The housing is provided with at least two support structures and at least two modules. A first of the support structures transfers vertical forces applied to one end of a module to an opposite end of the opposite module. A second of the support structures inhibits a pivoting of the modules about the first support structure.
摘要:
Various embodiments of an optical proximity sensor having a lead frame and no overlying metal shield are disclosed. In one embodiment, a light emitter and a light detector are mounted on a lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another. An integrated circuit is die-attached to an underside of the lead frame. An optically-transmissive infrared pass compound is molded over the light detector and the light emitter and portions of the lead frame. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide an optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.
摘要:
An optical proximity sensor is provided that comprises an infrared light emitter an infrared light detector, a first molded optically transmissive infrared light pass component disposed over and covering the light emitter and a second molded optically transmissive infrared light pass component disposed over and covering the light detector. Located in-between the light emitter and the first molded optically transmissive infrared light pass component, and the light detector and the second molded optically transmissive infrared light pass component is a gap. Layers of infrared opaque, attenuating or blocking material are disposed on at least some of the external surfaces forming the gap to substantially attenuate or block the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector, and thereby minimize optical crosstalk and interference between the light emitter and the light detector.
摘要:
Various embodiments of an optical proximity sensor having a lead frame and no overlying metal shield are disclosed. In one embodiment, a light emitter and a light detector are mounted on a lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another. An integrated circuit is die-attached to an underside of the lead frame. An optically-transmissive infrared pass compound is molded over the light detector and the light emitter and portions of the lead frame. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide an optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.
摘要:
Disclosed is a method for identifying a number of interactions with a computer input area defined by at least first and second intersecting sets of detection paths. First, indications of which of the detection paths are affected by the interactions are received. Then, for each of the detection path sets, the set's indications of affected detection paths are parsed to identify up to N extents of adjacent, affected detection paths (N≧2). A controller having logic to implement the method, and a system incorporating a control system that implements the method, are also disclosed.
摘要:
A transceiver having a light source die, a photodetector die and a substrate is disclosed. The substrate has a first well in which the light source die is mounted and a second well in which the photodetector die is mounted. The substrate has a reflective surface which blocks light leaving the light source from reaching the photodetector unless the light is reflected by an object external to the transceiver. The reflecting surface of the second well in the substrate is shaped to concentrate light received from outside the transceiver onto the photodetector, and in one aspect of the invention it comprises a non-imaging optical element. The light source is powered by applying a potential between first and second contacts on the light source die. A signal is generated between first and second contacts on the photodetector die in response to illumination of the photodetector die.
摘要:
An optical proximity sensor is provided that comprises an infrared light emitter operably connected to and driven by a light emitter driving circuit and a light detector operably connected to and driven by a detector sensing circuit. A metal housing or shield formed of metal and comprising first and second apertures surrounds the light emitter and the light detector such that at least a first portion of light emitted by the light detector passes through the first aperture, and at least a second portion of the first portion of light reflected from an object of interest in proximity to the sensor passes through the second aperture for detection by the light detector. The metal housing or shield further comprises first and second modules within which the light detector and light detector are disposed, respectively. The first and second modules comprise adjoining optically opaque metal inner sidewalls that provide optical isolation between the first and second modules, where the first and second inner sidewalls are separated from one another by at least one metal tab foldably disposed therebetween. The at least one metal tab is configured to transfer a vertical force applied to one end of one module to an opposite end of the other module.
摘要:
A bi-curvature lens for diodes in an infrared wireless communication transceiver is disclosed. Devices having such a bi-curvature lens, such as a light emitting device, a light detecting device, and a transceiver are also disclosed. A method for designing such a lens, and a method for fabricating a device having such a lens are also disclosed. The bi-curvature lens disclosed has a bottom hemispherical portion and a top aspherical portion. Light emitting diodes and photo detectors used in conjunction with bi-curvature lenses display symmetrical radiation intensity profiles, in accordance with Infrared Data Association standards and protocols.
摘要:
In one embodiment, each of a plurality of optical angle detectors has a plurality of light sensing elements and is positioned at a different location adjacent an optical input area. Each of a plurality of light-control devices is positioned between the optical input area and one of the optical angle detectors, to cause particular rays of light to be mapped to particular light sensing elements of a respective one of the optical angle detectors. The optical angle detectors are positioned to cause each coordinate in the optical input area to be within a field of view of at least two of the optical angle detectors. Other embodiments are also disclosed.