发明授权
- 专利标题： Substrate connector for integrated circuit devices
- 专利标题（中）： 用于集成电路器件的基板连接器
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申请号： US11173657申请日： 2005-06-30
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公开(公告)号： US07495330B2公开(公告)日： 2009-02-24
- 发明人: Kinya Ichikawa
- 申请人： Kinya Ichikawa
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Konrad Raynes & Victor LLP
- 主分类号： H01L23/04
- IPC分类号： H01L23/04
摘要：
In one embodiment, a stack is assembled comprising a first integrated circuit package, and a substrate connector which connects the integrated circuit package to a circuit board. In one embodiment, the substrate connector includes an interposer substrate and a patch substrate bonded to the interposer substrate. Each substrate includes columnar conductors extending through the substrate to connect to another layer. Other embodiments are described and claimed.
公开/授权文献
- US20070001277A1 Substrate connector for integrated circuit devices 公开/授权日：2007-01-04
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