发明授权
- 专利标题: Film coating unit and film coating method
- 专利标题(中): 薄膜涂布单元和薄膜涂布方法
-
申请号: US10875075申请日: 2004-06-23
-
公开(公告)号: US07497908B2公开(公告)日: 2009-03-03
- 发明人: Tsuyoshi Mizuno , Yuuichi Mikata , Kimihide Saito
- 申请人: Tsuyoshi Mizuno , Yuuichi Mikata , Kimihide Saito
- 申请人地址: JP JP
- 专利权人: Sanyo Electric Co., Ltd,Kabushiki Kaisha Toshiba
- 当前专利权人: Sanyo Electric Co., Ltd,Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP JP
- 代理机构: Andrus, Sceales, Starke & Sawall, LLP
- 优先权: JP2003-178626 20030623
- 主分类号: B05C5/02
- IPC分类号: B05C5/02
摘要:
Film coating unit has a substrate holder for holding a wafer, a coating solution discharge nozzle, and anti-drying boards opposed to a surface of the wafer. The coating solution is applied to the surface of the wafer in a direction from a front end toward a rear end of the wafer while relatively moving the substrate holder with respect to the coating solution discharge nozzle. During that time, the anti-drying boards are disposed at height of maximum 2 mm from the surface of the wafer so as to form dense atmosphere of a solvent between the surface of the wafer and the anti-drying board. Thereby the coating solution on or over the surface of the wafer is restrained from being dried and a coating film is formed with even thickness on or over the surface of the wafer.
公开/授权文献
- US20040265493A1 Film coating unit and film coating method 公开/授权日:2004-12-30