发明授权
- 专利标题: Molding die method
- 专利标题(中): 成型模具法
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申请号: US10850030申请日: 2004-05-19
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公开(公告)号: US07497976B2公开(公告)日: 2009-03-03
- 发明人: Katsuhiro Doi , Yumiko Aizawa
- 申请人: Katsuhiro Doi , Yumiko Aizawa
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Frommer Lawrence & Haug LLP
- 代理商 William S. Frommer; Paul A. Levy
- 优先权: JP2000-367523 20001201
- 主分类号: B29C45/63
- IPC分类号: B29C45/63
摘要:
A molding die apparatus and a method thereof are provided, which ensures for air and gas (or fluid) present in a resin filling space to be exhausted so as to be able to fill molten resin into the cavity smoothly and uniformly thereby enabling production of a high quality molded resin product suitable as an optical disc substrate or the like having optimum optical properties required therefore. The molding die apparatus for obtaining the molded product by injecting the molten resin into a cavity that is formed between dies includes a vacuum apparatus which is disposed in proximity to the cavity, the vacuum apparatus including a vacuum tank, an exhaustion channel and a vacuum valve which controls open and close of a channel between the vacuum tank and the exhaustion channel, and the cavity is exhausted efficiently and rapidly by the vacuum apparatus.
公开/授权文献
- US20040212121A1 Molding die method 公开/授权日:2004-10-28
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