发明授权
- 专利标题： Placement system for populating a substrate with electronic components
- 专利标题（中）： 用电子部件填充基板的放置系统
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申请号： US11348762申请日： 2006-02-07
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公开(公告)号： US07500305B2公开(公告)日： 2009-03-10
- 发明人: Jürgen Högerl , Jens Pohl , Uta Sasse , Ingo Wennemuth
- 申请人： Jürgen Högerl , Jens Pohl , Uta Sasse , Ingo Wennemuth
- 申请人地址： DE Munich
- 专利权人： Qimonda AG
- 当前专利权人： Qimonda AG
- 当前专利权人地址： DE Munich
- 代理商 Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- 优先权： DE10121578 20010503
- 主分类号： B23P19/00
- IPC分类号： B23P19/00
摘要：
A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.
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