Invention Grant
- Patent Title: Thermal analysis apparatus
- Patent Title (中): 热分析仪
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Application No.: US11705669Application Date: 2007-02-13
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Publication No.: US07500779B2Publication Date: 2009-03-10
- Inventor: Toshitada Takeuchi , Masakatsu Hasuda
- Applicant: Toshitada Takeuchi , Masakatsu Hasuda
- Applicant Address: JP
- Assignee: SII NanoTechnology Inc.
- Current Assignee: SII NanoTechnology Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2006-052602 20060228
- Main IPC: G01N25/00
- IPC: G01N25/00

Abstract:
A thermal analysis apparatus possesses has a cylindrical furnace tube axially inserted in a cylindrical heating furnace, and a pair of sample holders extending axially inside the furnace tube. The furnace tube is supported by two axially spaced groups of butting members, each group having three or more butting members that are disposed in circumferentially spaced-apart relationship on the outside of the furnace tube and that butt against the furnace tube to restrain positional deviation thereof in a radial direction while permitting expansion and contraction thereof in the axial direction during heating of the furnace tube by the heating furnace.
Public/Granted literature
- US20070201533A1 Thermal analysis apparatus Public/Granted day:2007-08-30
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