Invention Grant
US07501692B2 Semiconductor lead frame, semiconductor package having the same, and method of plating the same 失效
半导体引线框,具有相同的半导体封装及其电镀方法

Semiconductor lead frame, semiconductor package having the same, and method of plating the same
Abstract:
Provided are a semiconductor lead frame, a semiconductor package having the semiconductor lead frame, and a method of plating the semiconductor lead frame. The method includes preparing a substrate formed of a Fe—Ni alloy (alloy 42), and a plating layer that contains grains less than 1 micrometer in size and is plated on the substrate. The growth of whiskers when a Sn plated layer is formed on a substrate formed of a Fe—Ni alloy (alloy 42) can be suppressed by minimizing the grain size of the Sn plated layer.
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