Invention Grant
US07501692B2 Semiconductor lead frame, semiconductor package having the same, and method of plating the same
失效
半导体引线框,具有相同的半导体封装及其电镀方法
- Patent Title: Semiconductor lead frame, semiconductor package having the same, and method of plating the same
- Patent Title (中): 半导体引线框,具有相同的半导体封装及其电镀方法
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Application No.: US11194872Application Date: 2005-08-01
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Publication No.: US07501692B2Publication Date: 2009-03-10
- Inventor: Woo-suk Choi , Joong-do Kim , Eun-hee Kim , Soo-bong Lee
- Applicant: Woo-suk Choi , Joong-do Kim , Eun-hee Kim , Soo-bong Lee
- Applicant Address: KR Changwon
- Assignee: Samsung Techwin Co., Ltd.
- Current Assignee: Samsung Techwin Co., Ltd.
- Current Assignee Address: KR Changwon
- Agency: Drinker Biddle & Reath LLP
- Priority: KR10-2004-0079188 20041005
- Main IPC: H01L23/495
- IPC: H01L23/495

Abstract:
Provided are a semiconductor lead frame, a semiconductor package having the semiconductor lead frame, and a method of plating the semiconductor lead frame. The method includes preparing a substrate formed of a Fe—Ni alloy (alloy 42), and a plating layer that contains grains less than 1 micrometer in size and is plated on the substrate. The growth of whiskers when a Sn plated layer is formed on a substrate formed of a Fe—Ni alloy (alloy 42) can be suppressed by minimizing the grain size of the Sn plated layer.
Public/Granted literature
- US20060071310A1 Semiconductor lead frame, semiconductor package having the same, and method of plating the same Public/Granted day:2006-04-06
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