发明授权
- 专利标题： Integrated circuit package system
- 专利标题（中）： 集成电路封装系统
-
申请号： US11276946申请日： 2006-03-17
-
公开(公告)号： US07501697B2公开(公告)日： 2009-03-10
- 发明人: Choong Bin Yim , Hyeog Chan Kwon , Jong-Woo Ha
- 申请人： Choong Bin Yim , Hyeog Chan Kwon , Jong-Woo Ha
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/28
摘要：
An integrated circuit package system is provided forming a carrier having a top side and a bottom side, forming an edge terminal pad on the top side and an inner terminal pad on the bottom side, connecting an integrated circuit die to an inner portion of the edge terminal pad, and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed.
公开/授权文献
- US20070216010A1 INTEGRATED CIRCUIT PACKAGE SYSTEM 公开/授权日：2007-09-20
信息查询
IPC分类:
