Invention Grant
US07503958B2 Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu solder powder
失效
制造SnZnNiCu焊料粉末和SnZnNiCu焊料粉末的方法
- Patent Title: Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu solder powder
- Patent Title (中): 制造SnZnNiCu焊料粉末和SnZnNiCu焊料粉末的方法
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Application No.: US11509567Application Date: 2006-08-25
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Publication No.: US07503958B2Publication Date: 2009-03-17
- Inventor: Eiichiro Matsubara , Tetsu Ichitsubo , Takaaki Anada , Seishi Kumamoto , Hisao Irie
- Applicant: Eiichiro Matsubara , Tetsu Ichitsubo , Takaaki Anada , Seishi Kumamoto , Hisao Irie
- Applicant Address: JP Hyogo
- Assignee: Harima Chemicals, Inc.
- Current Assignee: Harima Chemicals, Inc.
- Current Assignee Address: JP Hyogo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-244442 20050825
- Main IPC: B22F9/08
- IPC: B22F9/08
Abstract:
The present invention is a method to manufacture the SnZnNiCu solder powder through liquid quenching atomizing method, and an atomizing temperature is not less than 500° C., in particular, not less than 900° C. The raw material metal used as raw material of the solder powder comprises 3 to 12% by weight of Zn, 1.0 to 15% by weight of the sum of Cu and Ni, and Sn and inevitable impurities for the rest, to the total amount of raw material. Thereby, high joint strength is achieved and the SnZnNiCu solder powder which can improve joint reliability of solder joint part is provided.
Public/Granted literature
- US20070051201A1 Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu solder powder Public/Granted day:2007-03-08
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