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US07504303B2 Trench-gate field effect transistors and methods of forming the same 失效
沟槽栅场效应晶体管及其形成方法

Trench-gate field effect transistors and methods of forming the same
摘要：
A method for forming a shielded gate field effect transistor includes the following steps. Trenches extending into a silicon region are formed using a mask that includes a protective layer. A shield dielectric layer lining sidewalls and bottom of each trench is formed. A shield electrode is formed in a bottom portion of each trench. Protective spacers are formed along upper sidewalls of each trench. An inter-electrode dielectric is formed over the shield electrode. The protective spacers and the protective layer of the mask prevent formation of inter-electrode dielectric along the upper sidewalls of each trench and over mesa surfaces adjacent each trench. A gate electrode is formed in each trench over the inter-electrode dielectric.
摘要（中）：

一种用于形成屏蔽栅极场效应晶体管的方法包括以下步骤。 使用包括保护层的掩模形成延伸到硅区域中的沟槽。 形成在每个沟槽的侧壁和底部内衬的屏蔽电介质层。 屏蔽电极形成在每个沟槽的底部。 保护间隔物沿每个沟槽的上侧壁形成。 在屏蔽电极上形成电极间电介质。 保护间隔物和掩模的保护层防止沿着每个沟槽的上侧壁和与每个沟槽相邻的台面表面形成电极间电介质。 在电极间电介质的每个沟槽中形成栅电极。

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