Invention Grant
- Patent Title: Planar split-gate high-performance MOSFET structure and manufacturing method
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Application No.: US11444853Application Date: 2006-05-31
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Publication No.: US07504676B2Publication Date: 2009-03-17
- Inventor: Anup Bhalla , Francois Hebert , Daniel S. Ng
- Applicant: Anup Bhalla , Francois Hebert , Daniel S. Ng
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha & Omega Semiconductor, Ltd.
- Current Assignee: Alpha & Omega Semiconductor, Ltd.
- Current Assignee Address: US CA Sunnyvale
- Agent Bo-In Lin
- Main IPC: H01L29/80
- IPC: H01L29/80

Abstract:
This invention discloses an improved semiconductor power device includes a plurality of power transistor cells wherein each cell further includes a planar gate padded by a gate oxide layer disposed on top of a drift layer constituting an upper layer of a semiconductor substrate wherein the planar gate further constituting a split gate including a gap opened in a gate layer whereby the a total surface area of the gate is reduced. The transistor cell further includes a JFET (junction field effect transistor) diffusion region disposed in the drift layer below the gap of the gate layer wherein the JFET diffusion region having a higher dopant concentration than the drift region for reducing a channel resistance of the semiconductor power device. The transistor cell further includes a shallow surface doped regions disposed near a top surface of the drift layer under the gate adjacent to the JFET diffusion region wherein the shallow surface doped region having a dopant concentration lower than the JFET diffusion region and higher than the drift layer.
Public/Granted literature
- US20070278571A1 Planar split-gate high-performance MOSFET structure and manufacturing method Public/Granted day:2007-12-06
Information query
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