Invention Grant
- Patent Title: Semiconductor laser device and manufacturing method thereof
- Patent Title (中): 半导体激光器件及其制造方法
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Application No.: US11390426Application Date: 2006-03-28
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Publication No.: US07505502B2Publication Date: 2009-03-17
- Inventor: Takayuki Kashima , Kouji Makita , Kenji Yoshikawa
- Applicant: Takayuki Kashima , Kouji Makita , Kenji Yoshikawa
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
In a monolithic dual-laser semiconductor laser device capable of high power output, a window structure for each of laser elements is formed through a common step, thereby improving the device reliability. The semiconductor laser device has an infrared laser element li0 and a red laser element 120 monolithically integrated on an n-type semiconductor substrate i01. Each of the infrared and red laser elements 110 and 120 has a ridged waveguide and a window structure formed by Zn diffusion at each resonator facet. The infrared and red laser elements ii0 and 120 include p-type contact layers 109 and 119 on the ridges of the respective waveguides. The p-type contact layer 109 is thinner than the p-type contact layer 119.
Public/Granted literature
- US20070237199A1 Semiconductor laser device and manufacturing method thereof Public/Granted day:2007-10-11
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