Invention Grant
US07509733B2 Method for producing means of connecting and/or soldering a component
失效
用于制造连接和/或焊接部件的装置的方法
- Patent Title: Method for producing means of connecting and/or soldering a component
- Patent Title (中): 用于制造连接和/或焊接部件的装置的方法
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Application No.: US11503856Application Date: 2006-08-14
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Publication No.: US07509733B2Publication Date: 2009-03-31
- Inventor: Francçis Marion
- Applicant: Francçis Marion
- Applicant Address: FR Paris
- Assignee: Commissariat A l'Energie Atomique
- Current Assignee: Commissariat A l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Burr & Brown
- Priority: FR0552611 20050830
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H01L21/44
Abstract:
A method for producing a plurality of stamped shapes to serve as a mechanism for connecting and/or soldering or sealing a component, on a substrate, including the steps of depositing a layer made of a ductile material on the substrate and stamping the layer by means of an etched die having the plurality of etched portions defining one or more shapes to form the plurality of stamped shapes.
Public/Granted literature
- US20070049065A1 Method for producing means of connecting and/or soldering a component Public/Granted day:2007-03-01
Information query
