Invention Grant
- Patent Title: Diamond substrate and method for fabricating the same
- Patent Title (中): 金刚石基板及其制造方法
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Application No.: US11380356Application Date: 2006-04-26
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Publication No.: US07510906B2Publication Date: 2009-03-31
- Inventor: Hsiao-Kuo Chang , Jen-Sheuan Huang , Chih-Peng Chen , Na-Ling Chen , Shih-Pang Wen
- Applicant: Hsiao-Kuo Chang , Jen-Sheuan Huang , Chih-Peng Chen , Na-Ling Chen , Shih-Pang Wen
- Applicant Address: TW Taipei
- Assignee: Kinik Company
- Current Assignee: Kinik Company
- Current Assignee Address: TW Taipei
- Agency: Workman Nydegger
- Priority: TW94113548A 20050427
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A diamond substrate and a method for fabricating the same are provided wherein a SiC layer is formed on a lower surface of a diamond layer for preventing the diamond layer from being deformed after the process of forming the diamond substrate, and then a semiconductor layer is formed on the diamond layer or directly formed on the surface of the SiC layer. Thereby, the lattice mismatch between the diamond film layer and the semiconductor layer is mitigated by the SiC layer, and the crystalline quality of the semiconductor layer is improved, the fabricating process of the diamond substrate is simplified, and the performance and stability are enhanced.
Public/Granted literature
- US20060243982A1 DIAMOND SUBSTRATE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2006-11-02
Information query
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