发明授权
- 专利标题： Sensor substrate and method of fabricating same
- 专利标题（中）： 传感器基板及其制造方法
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申请号： US10861976申请日： 2004-06-04
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公开(公告)号： US07514038B2公开(公告)日： 2009-04-07
- 发明人: Shaun Pendo , Rajiv Shah , Edward Chernoff
- 申请人： Shaun Pendo , Rajiv Shah , Edward Chernoff
- 申请人地址： US CA Northridge
- 专利权人： Medtronic Minimed, Inc.
- 当前专利权人： Medtronic Minimed, Inc.
- 当前专利权人地址： US CA Northridge
- 代理机构： Foley & Lardner LLP
- 主分类号： G01N21/00
- IPC分类号： G01N21/00 ; H05K3/40 ; H05K1/03
摘要：
A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
公开/授权文献
- US20040223875A1 Sensor substrate and method of fabricating same 公开/授权日：2004-11-11
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