发明授权
US07515241B2 Bonding structure for flat panel display and method having outer and inner walls of a predetermined interval having sealant and bonded to upper and lower substrates for unimpeded cell gap between the substrates and the inner separation wall
有权
用于平板显示器的接合结构和具有预定间隔的外壁和内壁的方法具有密封剂并且粘合到上基板和下基板上以在基板之间无阻碍的单元间隙和内分隔壁
- 专利标题： Bonding structure for flat panel display and method having outer and inner walls of a predetermined interval having sealant and bonded to upper and lower substrates for unimpeded cell gap between the substrates and the inner separation wall
- 专利标题（中）： 用于平板显示器的接合结构和具有预定间隔的外壁和内壁的方法具有密封剂并且粘合到上基板和下基板上以在基板之间无阻碍的单元间隙和内分隔壁
-
申请号： US11066783申请日： 2005-02-28
-
公开(公告)号： US07515241B2公开(公告)日： 2009-04-07
- 发明人: Su-gun Kim , Sang-moo Park , Soon-young Hyun , Won-nyun Kim , Jong-min Wang , Gyu-min Lee
- 申请人： Su-gun Kim , Sang-moo Park , Soon-young Hyun , Won-nyun Kim , Jong-min Wang , Gyu-min Lee
- 申请人地址： KR Suwon-Si, Gyeonggi-Do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-Si, Gyeonggi-Do
- 代理机构： Buchanan Ingersoll & Rooney PC
- 优先权： KR10-2004-0028162 20040423
- 主分类号： G02F1/1339
- IPC分类号： G02F1/1339
摘要：
Provided are a bonding structure for a flat panel display and a method of forming the same, and a flat panel display, including the bonding structure. The bonding structure of a flat panel display device, which is formed between an upper substrate and a lower substrate to seal and bond the two substrates of the flat panel display device, and the bonding structure includes an outer separation wall and an inner separation wall of same heights being arranged along edges of the upper substrate and the lower substrate with a predetermined interval, and a sealant being applied between the outer separation wall and the inner separation wall.
公开/授权文献
信息查询
IPC分类:
