摘要:
Disclosed is a display device. The display device includes a light source; a wavelength conversion member converting a wavelength of light output from the light source; a display panel to which the light is incident; a heat transfer part adjacent to the light source and the wavelength conversion member; and a heat dissipation part connected to the heat transfer part.
摘要:
Disclosed are a light conversion member, a display device including the same, and a method for fabricating the same. The light conversion member includes a host, a plurality of light conversion particles in the host, and a ferroelectric material in the host.
摘要:
Disclosed is a display device. The display device includes a light source; a wavelength conversion member converting a wavelength of light output from the light source; a display panel to which the light is incident; a heat transfer part adjacent to the light source and the wavelength conversion member; and a heat dissipation part connected to the heat transfer part.
摘要:
Disclosed are an optical member, a display device having the same, and a method of fabricating the same. The optical member includes a receiving part having an empty space therein, a host in the receiving part, a plurality of wavelength conversion particles in the host, a sealing part in the receiving part, and a pre-treatment layer between the sealing part and an inner surface of the receiving part.
摘要:
Disclosed are an optical member, a display device having the same and a method of fabricating the same. The optical member includes a host; a plurality of light conversion particles dispersed in the host to convert a wavelength of light generated from a light source; and a protective layer surrounding the host and including plastic.
摘要:
Disclosed are an optical member and a display device including the same. The optical member includes a receiving member; a host in the receiving member; and a plurality of wavelength conversion particles distributed in the host. The receiving member includes a light incident part having a first refractive index; and a light exit part having a second refractive index different from the first refractive index. The optical member improves the optical characteristics by adjusting the refractive indexes of the light incident part and the light exit part.
摘要:
Provided are a bonding structure for a flat panel display and a method of forming the same, and a flat panel display, including the bonding structure. The bonding structure of a flat panel display device, which is formed between an upper substrate and a lower substrate to seal and bond the two substrates of the flat panel display device, and the bonding structure includes an outer separation wall and an inner separation wall of same heights being arranged along edges of the upper substrate and the lower substrate with a predetermined interval, and a sealant being applied between the outer separation wall and the inner separation wall.
摘要:
Disclosed is a display device. The display device includes a light source; a wavelength conversion member adjacent to the light source; and a display panel to which light output from the wavelength conversion member is incident, wherein the wavelength conversion member includes an inclined surface which is inclined with respect to a surface perpendicular to an optical axis of the light source.
摘要:
Disclosed is a display device. The display device includes a light source; a wavelength conversion member adjacent to the light source; and a display panel to which light output from the wavelength conversion member is incident, wherein the wavelength conversion member includes an inclined surface which is inclined with respect to a surface perpendicular to an optical axis of the light source.
摘要:
A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.