发明授权
- 专利标题: Multi-functional composite substrate structure
- 专利标题(中): 多功能复合基板结构
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申请号: US11646339申请日: 2006-12-28
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公开(公告)号: US07515435B2公开(公告)日: 2009-04-07
- 发明人: Uei-Ming Jow , Chang-Sheng Chen , Chin-Sun Shyu , Min-Lin Lee , Shinn-Juh Lay , Ying-Jiunn Lai
- 申请人: Uei-Ming Jow , Chang-Sheng Chen , Chin-Sun Shyu , Min-Lin Lee , Shinn-Juh Lay , Ying-Jiunn Lai
- 申请人地址: TW Hsinchu
- 专利权人: Industrial Technology Research Institute
- 当前专利权人: Industrial Technology Research Institute
- 当前专利权人地址: TW Hsinchu
- 代理机构: Rabin & Berdo, P.C.
- 优先权: TW95101511A 20060113
- 主分类号: H05K1/16
- IPC分类号: H05K1/16
摘要:
A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are interlaced above the third substrate. One or more permeance blocks may be formed above each substrate, so that one or more inductors may be fabricated thereon. One or more capacitors may be fabricated on the first substrate. Also, one or more signal transmission traces of the system impedance are formed on the second substrate of the outside layer. Therefore, the inductance of the inductor(s) is effectively enhanced. Moreover, the area of built-in components is reduced. Furthermore, it has shorter delay time, smaller dielectric loss, and better return loss for the transmission of high speed and high frequency signal.
公开/授权文献
- US20070164396A1 Multi-functional composite substrate structure 公开/授权日:2007-07-19
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