发明授权
- 专利标题： Scalable device-to-device interconnection
- 专利标题（中）： 可扩展的设备到设备互连
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申请号： US10645045申请日： 2003-08-20
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公开(公告)号： US07516237B2公开(公告)日： 2009-04-07
- 发明人: Bradley J. Booth , Quang Le
- 申请人： Bradley J. Booth , Quang Le
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： G06F15/16
- IPC分类号： G06F15/16 ; H04J3/16
摘要：
Described are a device and system to transmit data to or receive data from one or more data lane interfaces. Each data lane interface may be capable of transmitting a serial data signal to or receiving a serial data signal from a data lane in a device-to-device interconnection. An effective data rate may be varied based, at least in part, upon a number of the data lane interfaces actively transmitting a serial data signal to or receiving a serial data signal from the device-to-device interconnection.
公开/授权文献
- US20050044257A1 Scalable device-to-device interconnection 公开/授权日：2005-02-24