发明授权
- 专利标题: Thin solid state drive housing structures
- 专利标题(中): 薄型固态驱动器外壳结构
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申请号: US11966827申请日: 2007-12-28
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公开(公告)号: US07517252B2公开(公告)日: 2009-04-14
- 发明人: Jim Chin-Nan Ni , Siew Sin Hiew , Abraham Chih-Kang Ma , Ming-Shiang Shen
- 申请人: Jim Chin-Nan Ni , Siew Sin Hiew , Abraham Chih-Kang Ma , Ming-Shiang Shen
- 申请人地址: US CA San Jose
- 专利权人: Super Talent Electronics, Inc.
- 当前专利权人: Super Talent Electronics, Inc.
- 当前专利权人地址: US CA San Jose
- 代理商 Roger H. Chu
- 主分类号: H01R24/00
- IPC分类号: H01R24/00
摘要:
Thin solid state drive (SSD) housing structures are described. According to one embodiment of the invention, a structure for housing an SSD includes a pair of brackets configured to support a PCBA of the SSD at either side of the PCBA via one or more ledges with corresponding fastener holes pre-configured thereon. The ledges are attached to inside surface of the brackets. Each of the brackets has a slab shape with a length and a height. The length is parallel to horizontal direction, while the height parallel to vertical. The ledges are located at mid-height and orientated substantially perpendicular to the brackets such that the PCBA is supported horizontally. In order to securely connect the PCBA with the brackets, a plurality of metal fasteners is used. The fasteners are placed through the fastener holes on the ledges and through corresponding alignment holes pre-configured on the PCBA.
公开/授权文献
- US20080192425A1 Thin Solid State Drive Housing Structures 公开/授权日:2008-08-14
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