An integrated circuit with a through-die via (TDV) interface for die stacking is described. One aspect of the invention relates to an integrated circuit die having an array of tiles arranged in columns. The integrated circuit die includes at least one interface tile. Each interface tile includes a logic element, contacts, and through die vias (TDVs). The logic element is coupled to a routing fabric of the integrated circuit die. The contacts are configured to be coupled to conductive interconnect of another integrated circuit die attached to the backside of the integrated circuit die. The TDVs are configured to couple the logic element to the contacts.