发明授权
- 专利标题： Micro-electromechanical structure with self-compensation of the thermal drifts caused by thermomechanical stress
- 专利标题（中）： 微机电结构具有由热机械应力引起的热漂移的自补偿
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申请号： US11226930申请日： 2005-09-14
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公开(公告)号： US07520171B2公开(公告)日： 2009-04-21
- 发明人: Angelo Merassi , Sarah Zerbini , Benedetto Vigna
- 申请人： Angelo Merassi , Sarah Zerbini , Benedetto Vigna
- 申请人地址： IT Agrate Brianza
- 专利权人： STMicroelectronics S.r.l.
- 当前专利权人： STMicroelectronics S.r.l.
- 当前专利权人地址： IT Agrate Brianza
- 代理机构： Seed IP Law Group PLLC
- 代理商 Lisa K. Jorgenson; Harold H. Bennett, II
- 优先权： EP04425705 20040922
- 主分类号： G01P15/125
- IPC分类号： G01P15/125 ; G01P3/00
摘要：
In a micro-electromechanical structure of semiconductor material, a detection structure is formed by a stator and by a rotor, which are mobile with respect to one another in presence of an external stress and are subject to thermal stress; a compensation structure of a micro-electromechanical type, subject to thermal stress and invariant with respect to the external stress, is connected to the detection structure thereby the micro-electromechanical structure supplies an output signal correlated to the external stress and compensated in temperature.
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