发明授权
- 专利标题: Magnetron sputtering apparatus and method for depositing a coating using same
- 专利标题(中): 磁控管溅射装置和使用其沉积涂层的方法
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申请号: US10963341申请日: 2004-10-12
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公开(公告)号: US07520965B2公开(公告)日: 2009-04-21
- 发明人: Ronghua Wei
- 申请人: Ronghua Wei
- 申请人地址: US TX San Antonio
- 专利权人: Southwest Research Institute
- 当前专利权人: Southwest Research Institute
- 当前专利权人地址: US TX San Antonio
- 代理机构: Grossman, Tucker et. al.
- 主分类号: C23C14/35
- IPC分类号: C23C14/35
摘要:
A method for depositing a coating using a magnetron sputtering apparatus and a magnetron sputtering apparatus comprising: a support structure comprising a hollowed shaft comprising a central conduit having a longitudinal axis; a sputter target material defining a bore which is external to the central conduit, the bore also having the longitudinal axis a magnet assembly supported about the support structure, the magnet assembly having a first end, a second end, and a plurality of magnets supported therebetween and being effective, upon rotation, to generate a circumferential external magnetic field about the sputter target material; a first sealed end extending radially inward from adjacent the sputter target material proximate the first end of the magnet assembly and a second sealed end extending radially inward from adjacent the sputter target material proximate the second end of the magnet assembly, wherein the first sealed end, the second sealed end, and the sputter target material seal the magnet assembly therebetween; a cooling system comprising one or more coolant passage extending through the magnet assembly, the central conduit comprising a coolant inlet and a coolant outlet at the first sealed end; and, one or more rotors supported about the support structure and rotatable therewith by coolant passing through the one or more coolant passages.
公开/授权文献
- US20060076235A1 System and apparatus for magnetron sputter deposition 公开/授权日:2006-04-13
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