发明授权
- 专利标题： Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
- 专利标题（中）： 用于微处理器和其他电子设备热点热管理的薄膜热电装置
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申请号： US10970378申请日： 2004-10-22
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公开(公告)号： US07523617B2公开(公告)日： 2009-04-28
- 发明人: Rama Venkatasubramanian , Randall G. Alley , Pratima Addepalli , Anil J. Reddy , Edward P. Siivola , Brooks C. O'Quinn , Kip D. Coonley , John Posthill , Thomas Colpitts
- 申请人： Rama Venkatasubramanian , Randall G. Alley , Pratima Addepalli , Anil J. Reddy , Edward P. Siivola , Brooks C. O'Quinn , Kip D. Coonley , John Posthill , Thomas Colpitts
- 申请人地址： US NC Durham
- 专利权人： Nextreme Thermal Solutions, Inc.
- 当前专利权人： Nextreme Thermal Solutions, Inc.
- 当前专利权人地址： US NC Durham
- 代理机构： Myers Bigel Sibley & Sajovec, P.A.
- 主分类号： F25B21/02
- IPC分类号： F25B21/02 ; F25D23/00 ; F28D15/00 ; H05K7/20
摘要：
A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.