发明授权
- 专利标题： Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same
- 专利标题（中）： 具有保护环的堆叠封装，其通过通孔互连插塞绝缘及其制造方法
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申请号： US11647704申请日： 2006-12-29
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公开(公告)号： US07525186B2公开(公告)日： 2009-04-28
- 发明人: Sung Min Kim , Min Suk Suh
- 申请人： Sung Min Kim , Min Suk Suh
- 申请人地址： KR Kyoungki-do
- 专利权人： Hynix Semiconductor Inc.
- 当前专利权人： Hynix Semiconductor Inc.
- 当前专利权人地址： KR Kyoungki-do
- 代理机构： Ladas & Parry LLP
- 优先权： KR10-2006-0096717 20060930
- 主分类号： H01L25/07
- IPC分类号： H01L25/07 ; H01L25/18 ; H01L23/02 ; H01L23/055 ; H01L23/12 ; H01L29/00
摘要：
A stack package comprises a substrate having a circuit pattern; at least two semiconductor chips stacked on the substrate, having a plurality of through-via interconnection plugs and a plurality of guard rings which surround the respective through-via interconnection plugs, and connected with each other by the medium of the through-via interconnection plugs; a molding material for molding an upper surface of the substrate including the stacked semiconductor chips; and solder balls mounted to a lower surface of the substrate.
公开/授权文献
- US20080079131A1 Stack package and method for manufacturing the same 公开/授权日：2008-04-03
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