Invention Grant
US07528064B2 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
有权
具有接合焊盘的互连结构和在焊盘上形成凸点位置的方法
- Patent Title: Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
- Patent Title (中): 具有接合焊盘的互连结构和在焊盘上形成凸点位置的方法
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Application No.: US11872607Application Date: 2007-10-15
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Publication No.: US07528064B2Publication Date: 2009-05-05
- Inventor: Sanh D. Tang , Mark E. Tuttle , Keith R. Cook
- Applicant: Sanh D. Tang , Mark E. Tuttle , Keith R. Cook
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/4763
- IPC: H01L21/4763
Abstract:
Microelectronic workpieces that have bump sites over bond-pads and methods of fabricating such bump sites. One embodiment of such a workpiece, for example, includes a substrate having a plurality of microelectronic dies comprising integrated circuitry and bond-pads, such as copper bond-pads, electrically coupled to the integrated circuitry. The workpiece further includes (a) a dielectric structure having a plurality of openings with sidewalls projecting from corresponding bond-pads, and (b) a plurality of caps over corresponding bond-pads. The individual caps can include a discrete portion of a barrier layer attached to the bond-pads and the sidewalls of the openings, and a discrete portion of a cap layer on the barrier layer. The caps are electrically isolated from each other and self-aligned with corresponding bond-pads without forming a mask layer over the cap layer.
Public/Granted literature
- US20080032494A1 INTERCONNECT STRUCTURES WITH BOND-PADS AND METHODS OF FORMING BUMP SITES ON BOND-PADS Public/Granted day:2008-02-07
Information query
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