- 专利标题： Providing variable sized contacts for coupling with a semiconductor device
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申请号： US11903962申请日： 2007-09-25
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公开(公告)号： US07530814B2公开(公告)日： 2009-05-12
- 发明人: Chandrashekhar Ramaswamy , Thomas G. Ruttan , Mark D. Summers
- 申请人： Chandrashekhar Ramaswamy , Thomas G. Ruttan , Mark D. Summers
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Trop, Pruner & Hu, P.C.
- 主分类号： H01R12/00
- IPC分类号： H01R12/00
摘要：
In one embodiment, the present invention includes a circuit board having integrated contacts to mate with corresponding pads of a semiconductor device. At least some of the integrated contacts are of varying sizes to enable different contact resistances between the corresponding integrated contacts and pads, enabling reduced loading forces to adapt the semiconductor device to the circuit board. Other embodiments are described and claimed.